The invention is directed towards structures for use with micro-formed
membrane ultrasonic transducers, and methods for fabricating the
structures. In one embodiment, the transducer includes a planar member
having a piezoelectric material and spaced apart electrodes disposed on
the planar member and coupled to the piezoelectric material for applying
an electric field to the layer, and an acoustic backing member joined to
the electrodes. In another embodiment, the transducer includes a planar
member having a piezoelectric material that adjoins a semiconductor
material, the semiconductor material having monolithically formed active
circuits formed in the layer and coupled to the piezoelectric material. In
still another embodiment, the transducer includes a planar member having a
piezoelectric material, and an acoustic backing member having an adjoining
layer of a semiconductor material having monolithically formed active
circuits, the active circuits being coupled to the electrodes.
