The present invention provides a polyolefin resin for hot melt adhesives
containing [I] a propylene polymer in an amount of 20 to 99 mass %, and
[II] an adhesive capacity applying resin in an amount of 80 to 1 mass %,
wherein [I] the propylene polymer satisfies the requirements of (1) a meso
pentad fraction (mmmm) is from 0.2 to 0.6; and (2) a racemic pentad
fraction (rrrr) and (1-mmmm) satisfy the relation:
[rrrr/(1-mmmm)].ltoreq.0.1. The polyolefin resin for hot melt adhesives is
superior in thermostability or flowing ability at high-temperature, easy
for coating, environmentally friendly with little fear of generating toxic
gas in the disposal and incineration, superior in adhesive property to
lowly polar substances and in heat resistance of the adhesion face.