A semiconductor element is mounted on a wiring circuit board in which a
circuit has been formed. This semiconductor element is resin-encapsulated
with a first encapsulating resin layer. Then, a second encapsulating resin
layer is formed, on the outer circumference of the first encapsulating
resin layer, from an epoxy resin composition containing the following
components (A) to (D): (A) epoxy resin; (B) phenolic resin; (C) curing
accelerator; and (D) at least one of the following particles (d1) and
(d2):
(d1) conductive particles whose surfaces are subjected to coating treatment
with an insulating inorganic material; and
(d2) magnetic particles whose surfaces are subjected to coating treatment
with an insulating inorganic material.
