A method of producing a pattern-formed structure, comprising: preparing a
substrate for a pattern-formed structure having a
characteristic-modifiable layer whose characteristic at a surface thereof
can be modified by the action of photocatalyst; preparing a
photocatalyst-containing-layer side substrate having a
photocatalyst-containing layer formed on a base material, the
photocatalyst-containing layer containing photocatalyst; arranging the
substrate for a pattern-formed structure and the
photocatalyst-containing-layer side substrate such that the
characteristic-modifiable layer faces the photocatalyst-containing layer
with a clearance of no larger than 200 .mu.m therebetween; and irradiating
energy to the characteristic-modifiable layer from a predetermined
direction, and modifying characteristic of a surface of the
characteristic-modifiable layer, thereby forming a pattern at the
characteristic-modifiable layer.
