A radiation sensitive resin composition for i-line light exposure
comprising an alkaline soluble resin and a quinonediazide group-containing
photosensitizer where said alkaline soluble resin comprises a novolak
resin and a mixture of one or two or more of resins selected from the
group of (i) polyacrylate, (ii) polymethacrylate, (iii) a polystyrene
derivative and (iv) a copolymer consisting of two or more of monomer units
selected from the group of acrylic ester, methacrylic ester and styrene
derivatives is applied on a substrate such as a substrate for a flat panel
display and exposed preferably at the light-exposure quantity of 50 to 500
mJ/cm.sup.2 by an i-line light exposure source to form a pattern with
high-resolution and a good pattern shape having no tailing.