A spring element used in a temporary package for testing semiconductors is
provided. The spring element is compressed so as to press the
semiconductor, either in the form of a bare semiconductor die or as part
of a package, against an interconnect structure. The spring element is
configured so that it provides sufficient pressure to keep the contacts on
the semiconductor in electrical contact with the interconnect structure.
Material is added and/or removed from the spring element so that it has
the desired modulus of elasticity. The shape of the spring element may
also be varied to change the modulus of elasticity, the spring constant,
and the force transfer capabilities of the spring element. The spring
element also includes conductive material to increase the thermal and
electrical conductivity of the spring element.
