Several embodiments of integrated circuit probe card assemblies are
disclosed, which extend the mechanical compliance of both MEMS and
thin-film fabricated probes, such that these types of spring probe
structures can be used to test one or more integrated circuits on a
semiconductor wafer. Several embodiments of probe card assemblies, which
provide tight signal pad pitch compliance and/or enable high levels of
parallel testing in commercial wafer probing equipment, are disclosed. In
some preferred embodiments, the probe card assembly structures include
separable standard components, which reduce assembly manufacturing cost
and manufacturing time. These structures and assemblies enable high speed
testing in wafer form. The probes also have built in mechanical protection
for both the integrated circuits and the MEMS or thin film fabricated
spring tips and probe layout structures on substrates. Interleaved spring
probe tip designs are defined which allow multiple probe contacts on very
small integrated circuit pads. The shapes of probe tips are preferably
defined to control the depth of probe tip penetration between a probe
spring and a pad or trace on an integrated circuit device. Improved
protective coating techniques for spring probes are also disclosed,
offering increased reliability and extended useful service lives for probe
card assemblies.
