A substrate and a method of making the substrate is provided. The substrate
includes a layer of metal with at least one through hole therein, the
layer of metal having an adhesion promoting layer thereon. A layer of a
partially cured low-loss polymer or polymer precursor is positioned on the
adhesion promoting layer and a plurality of conductive circuit lines are
positioned on a portion of the partially cured dielectric layer. The
substrate can be used as a building block in the fabrication of a
multilayered printed circuit board.
