A semiconductor optical radiation package includes a leadframe, at least
one semiconductor optical radiation emitter, and an encapsulant. The
leadframe has a heat extraction member, which supports the semiconductor
optical emitter and provides one or more thermal paths for removing heat
generated within the emitter to the ambient environment, as well as at
least two electrical leads for providing electrical coupling to the
semiconductor optical radiation emitter. The encapsulant covers and
protects the emitter and optional wire bonds from damage and allows
radiation to be emitted from the emitter into the ambient environment. The
semiconductor optical radiation package provides high emitted flux and is
preferably compatible with automated processing techniques.
