An electronic component includes a laminate having a structure in which an
element substrate and a sealing substrate are bonded to each other through
an adhesive layer, a terminal electrode is arranged on the element
substrate so as to be exposed at an end surface of the laminate, an
outside electrode is disposed on the outer surface of the sealing
substrate, the terminal electrode and the outside electrode are
electrically connected to each other through an end surface electrode
disposed on the end surface of the laminate, and the thickness of the end
surface electrode is between about one half of the thickness of the
adhesive layer and about five times of the thickness thereof.
