A connector assembly includes a ring sub-assembly mounted on the housing of
an implantable medical device with a passage for slidably receiving a
proximal terminal of an electrical lead. The interior of the connector
assembly is sealed when engaged with the electrical lead and has an
annular shoulder in the passage facing away from the entrance. An
electrical contact on the ring sub-assembly engages the electrical lead
and an electrical conductor extends from that contact to exterior regions
for electrical engagement with an external feed-through terminal of the
housing. A tip sub-assembly having a tubular extremity extending to a
terminal rim is fittingly received within the passage and extends to a
terminal bore for slidably receiving a tip electrode of the electrical
lead. An electrically conductive resilient member is received in the
passage sandwiched between the annular shoulder and the terminal rim of
the tubular extension and is electrically coupled to the electrical
contact of the connector assembly.
