The physical property data of the object to be heated, set temperatures of
heaters and blowers are provided to a reflow apparatus, and view factor
setting data for determining the view factor of the surface-mounted
circuit board are input. From the input these data, the number of heaters
and blowers, and the heating characteristic data peculiar to the reflow
apparatus, such as the heat transfer coefficient, the speed of conveyor
and the like, the view factor is simply determined, and the temperature of
the surface-mounted circuit board at the time of passing through the
reflow apparatus is calculated with respect to the board and parts mounted
thereon, using the determined view factor.
