The invention includes methods of forming a substrate having a surface comprising
at least one of Pt, Pd, Co and Au in at least one of elemental and alloy forms.
In one implementation, a substrate is provided which has a first substrate surface
comprising at least one of Pt, Pd, Co and Au in at least one of elemental and alloy
forms. The first substrate surface has a first degree of roughness. Within a chamber,
the first substrate surface is exposed to a PF3 comprising atmosphere
under conditions effective to form a second substrate surface comprising at least
one of Pt, Pd, Co and Au in at least one of elemental and alloy forms which has
a second degree of roughness which is greater than the first degree of roughness.
The substrate having the second substrate surface with the second degree of roughness
is ultimately removed from the chamber.
