A fiber-coupled optical component package comprises a high thermal conductivity
base, a housing including a ceramic substrate, an optical component mount aperture
formed on the substrate and a substantially planar fiber mount region on the substrate
adjacent to the optical component mount aperture. An optical component may be secured
within an area defined by the optical component mount aperture and an optical fiber
may be secured to the substantially planar fiber mount region to optically couple
the fiber and the optical component. A package lid may be placed over one or more
of the housing, the optical component, and a portion of the fiber.
