A low softening temperature thermal conductive adhesive composition is made from
a blend of liquid NBR in molecular weight of 300100,000 and ethylene vinyl
acetate (EVA) to have a softening point of 3865 C. With proper addition
of sub-micron or nano powder thermal conductive agents like aluminum oxide, zinc
oxide, aluminum nitride, boron nitride, graphite, metal powder or nano clay, the
adhesive can be made into a membrane with thickness of 0.015 mm and thermal
conductivity of 0.55 W/m-K, and thermal conductive plate with thermal resistance
of 0.0050.2 C.in2/W. The thermal conductive plate has softening
point of 3865 C., preferably 45 C. to avoid liquidation during
storage and transportation. Further application includes use as the sealant or
thermal conductive interface in electronic components and heat dissipaters to reduce
heat resistance and improve thermal conductive efficiency.
