In a method of producing a semiconductor laser apparatus, a conductive die-bonding
paste is applied to a bonding surface in a predetermined position thereof and then
preheated at a temperature equal to or higher than a temperature at which a diluent
of the conductive die-bonding paste starts to transpire, but lower than a temperature
at which the conductive die-bonding paste starts a thermosetting reaction. Then,
with a semiconductor laser chip placed on the preheated conductive die-bonding
paste, the latter is heated to be hardened. In the thus produced semiconductor
laser apparatus, a highest position at which the conductive die-bonding paste adheres
to end surfaces of the semiconductor laser chip is at a height of more than 0.01
mm from the bonding surface, but is below light-emitting points of the semiconductor
laser chip.
