A tamper indicating label is provided. The label may include RFID components
and
a tamper track coupled to the RFID components. The tamper track should be constructed
from a destructible conducting path. Additionally, the tamper track can be formed
such that it is damaged when the label is tampered. In one embodiment, adhesion
characteristics of the tamper track are adapted to break apart the tamper track
when the label is tampered, for example, by removal from an object. The RFID components
may retain their RF capability and detect when the tamper track has been damaged
to indicate that the label has been tampered. Alternatively, the RFID capability
of the RFID components may be disabled when the tamper track is damaged, indicating tampering.
