A calibration wafer which is suitable for calibrating alignment of a
transfer robot blade with respect to wafers in a loadlock chamber or
input shuttle. The calibration wafer includes a circular wafer body on
which is provided a pair of spaced-apart blade alignment lines which are
used to properly align the transfer robot blade. The invention further
includes a calibration kit for calibrating alignment of a polishing head
with a pedestal, including a base plate for placement on the pedestal; a
calibration plate for placement on the base plate; and a calibration
circle provided on the calibration plate for aligning the polishing head
with the pedestal.
