A semiconductor die and an associated low resistance interconnect located
primarily on the bottom surface of such die is disclosed. This arrangement
provides a flexible packaging structure permitting easy interconnected
with other integrated circuits; in this manner, a number of such circuits
can be stacked to create high circuit density multi-chip modules. A
process for making the device is further disclosed. To preserve structural
integrity of a wafer containing such die during manufacturing, a
through-hole via formed as part of the interconnect is filled with an
inert material during operations associated with subsequent active device
formation on such die.
