The invention is to form plated films on a conductive foil a thigh precision,
and simplify a procedure of forming the plated film. A resin film composed of a
thermosetting resin is formed on the surface of the conductive foil. The resin
film of parts which become bonding pads and die pads is eliminated by a laser etching.
A clamper presses of the periphery of the block so as to form hermetically sealed
spaces on the block. The interior of the clamper is filled with a plating liquid
by means of an injection means and an evacuation means, and subsequently, and Ag
plated film is formed by an electroplating method.
