A wick for use in a heat pipe is provided incorporating particles of micro-encapsulated
phase change material bonded together to form the wick. Use of a wick structure
comprising micro-encapsulated PCM particles has the advantage of providing an additional
heat absorber. This greatly enhances the ability of the heat pipe to absorb excess
heat and may help to prevent damage to the heat pipe or heat generating component,
such as an electronic device, especially at times of peak thermal loads.
