A spray cooling system for efficiently thermally managing a single or multiple
semiconductor chip package. The spray cooling system includes a heat exchanger
unit having a pump unit and a reservoir, a coaxial tube fluidly connected to the
heat exchanger unit, a coupler unit attached to the coaxial tube, and a spray module
where the coupler unit is removably connected to the spray module. The heat exchanger
unit has an air tolerant design that allows for the entry and release of air without
interfering with the operation thereof.
