A method for manufacturing a double-sided circuit board from a board material
having
a first electric conductor layer and a first electrically insulating layer, including
the steps of: making conduction holes in the board material so as to penetrate
only the first electrically insulating layer or both the first electrically insulating
layer and the first electric conductor layer; forming an electrically conductive
thin-film layer on a surface of the first electrically insulating layer and wall
surfaces of the conduction holes; forming a second electrically insulating layer
on the electrically conductive thin-film layer; forming a first electric conductor
wiring by electroplating on predetermined portions of the electrically conductive
thin-film layer; covering the first electric conductor wiring with a chemical-resistant
film; forming a second electric conductor wiring by chemically dissolving a predetermined
portion of another surface of the first electric conductor layer; and removing
the second electrically insulating layer and the film.
