An organic semiconductor device (11) can be embedded within a printed
wiring
board (10). In various embodiments, the embedded device (11) can
be accompanied by other organic semiconductor devices (31) and/or passive
electrical components (26). When so embedded, conductive vias (41, 42,
43) can be used to facilitate electrical connection to the embedded device.
In various embodiments, specific categories of materials and/or processing steps
are used to facilitate the making of organic semiconductors and/or passive electrical
components, embedded or otherwise.
