A method for manufacturing wired circuit board that enables a wired circuit board
of high quality to be manufactured without changing in dimension of the wired circuit
board substantially. In this method, the wired circuit board is wound in layers
in the winding process in such a manner that after an uncured thermosetting resin
layer is formed on the wired circuit board in the resin layer forming process,
a right-side spacer and a left-side spacer are disposed on the already wound wired
circuit board at both widthwise ends thereof and also an upper spacer is disposed
on the right-side spacer and the left-side spacer so as to cover a widthwise area
of the wired circuit board, so that the right-side spacer, the left-side spacer
and the upper spacer are positioned between the layers of the wired circuit board
when wound. Thereafter, the wired circuit board wound in the rolled state is heated
as it is, to cure the uncured thermosetting resin layer in the curing process.
