A release layer is formed on a substrate, and plural thin-film patterns are formed
on the release layer. The release layer is etched back at a prescribed depth at
least in regions close to the circumferences of the thin-film patterns. The thin-film
patterns are transferred sequentially to a counter substrate to be laminated on
the counter substrate and to thereby form a micro structure. This manufacturing
method is employed in a case that the combination of thin-film patterns and are
lease layer is such that when a prescribed pressure is applied to each of the thin-film
patterns on the release layer in the transferring, the height of a raised portion
of the release layer that would be appeared in a region close to the circumference
of the thin-film pattern if the release layer were not be etched back is greater
than or equal to the thickness of the thin-film pattern.
