The invention relates to a process of forming an on-chip package inductor. The
process includes providing a substrate with at least one microelectronic device
packaged therewith. As part of the inventive process, electrical communication
is formed for the microelectronic device. The electrical communication includes
at least two electrically conductive layers. As part of the inventive technology,
the inductor is patterned on the substrate before, during, or after formation of
the electrical communication. The inductor is connected to the at least one microelectronic device.
