A heat sink includes at least one heat pipe attached to a base having a substantially
flat region for interfacing with an electronic component. Additionally, the heat
sink comprises fins attached to the base and at least one heat pipe. The fins and
the base may be integral with or attached to each other. Such a heat sink can dissipate
heat from one or more electronic components more efficiently as the heat pipe coupled
with the fins attached to the base provide alternate heat transfer paths for heat
generated by electronic components.
