The invention relates to heat engineering, in particular to heat pipes and can
be used for removing heat from miniature high-heat object, in particular elements
of radiotechnical instruments and computers requiring efficient removal of heat
and minimum dimensions of a cooling system, the aim of said invention is to increase
the heat load of an evaporation chamber at a predetermined temperature and to reduce
the dimensions thereof. The inventive evaporation chamber for a loop heat pipe
comprises a body having a side and an end wall and a capillary-porous orifice provided
with steam-outlet channels and arranged inside said chamber. Said steam-outlet
channels are united with the aid of a steam header and disposed on the part of
the orifice perimeter of the side of a heat sink. Said evaporation chamber is also
provided with an asymmetric hold offset in a direction opposite with respect to
the heat sink. The ends of the steam-outlet channels are embodiment in such a way
that they are dead on one side thereof. The asymmetric hole is also embodiment
in such a way that it is dead on the side thereof which is opposite to the dead
ends of the steam-outlet channels, the steam header being formed by one wall of
the body and the end of the orifice.
