An electronic package for use with a printed circuit board is provided. The electronic
package includes a ground layer having an upper and lower section, a semiconductor
chip, a conductive signal layer and a ground plane having a first section electrically
connected to the upper section of the ground layer and a second section substantially
planar with said lower section of said ground layer, the second section of the
ground plane having an additional area to prevent cracking of a solder connection
between the ground layer, the ground plane and the printed circuit board.
