A manufacturing method of an electronic device is to improve test efficiency
using
test structure and improve yield. The manufacturing method performs test using
a first lead wire disposed on an insulating layer formed on a substrate and a second
lead wire electrically connected to the substrate and disposed on the insulating
layer and manages the electronic device on the basis of results of the test to
manufacture the electronic device. The manufacturing method includes a step of
testing whether the first lead wire is disconnected or not by measuring an electric
resistance between both ends of the first lead wire and a step of testing whether
the first and second lead wires are short-circuited or not by measuring an electric
resistance between the first lead wire and the substrate.
