An integrated circuit package is disclosed. The integrated circuit package includes
a package substrate having a top and a bottom. Further, the integrated circuit
package includes a plurality of bypass capacitors coupled to the bottom of the
package substrate without a cavity. Moreover, the integrated circuit package includes
an array of solder balls formed on the bottom of the package substrate. The array
of solder balls facilitates surface mounting to a printed circuit board assembly.
Also, the solder balls provide sufficient space between the printed circuit board
assembly and the bypass capacitors. In an embodiment, the package substrate is
an organic substrate.
