A heat-softening heat-radiation sheet including a polyolefin-based heat-conductive
composition which comprises a polyolefin and a heat-conductive filler, has a softening
point of 40 C. or above, has a thermal conductivity of 1.0 W/mK or higher,
has a viscosity at 80 C. of from 1102 to 1105
Pas and has a plasticity at 25 C. in the range of from 100 to
700. This heat-radiation sheet which is in the form of a solid sheet at room temperature,
can readily be attached to or detached from electronic components and a heat sink,
is capable of softening by the heat generated during operation of electronic components,
to have the interfacial contact thermal resistance at a negligible level, and has
a superior heat-radiation performance.
