The present invention discloses a thermal transfer interface having an integrally
formed means for fastening and maintaining intimate thermal contact between a heat
generating device and a heat-dissipating device. The interface of the present invention
includes two components, a compressible thermal transfer component having a first
thickness and an adhesive fastening component having a second thickness that is
less than the first. The first component, the thermal transfer element, includes
a base polymer matrix compound that is loaded with a thermally conducting filler
that imparts thermally conductive properties to the net shape moldable material.
The polymer base matrix is preferably a highly compressible material such as an
elastomer. The second component of the present invention is a pressure sensitive
adhesive component. The adhesive is applied adjacent to the thermal transfer element
or in an alternating pattern throughout a base field of thermal transfer material.
The adhesive component has a thickness that is less than the overall thickness
of the thermal transfer material. When, the heat dissipating device with the present
invention applied is pressed into contact with a heat generating surface the elastomer
is compressed and maintained in the compressed state by the pressure sensitive
adhesive material.
