A semiconductor wafer saw and method of using the same for dicing semiconductor
wafers including a wafer saw including variable lateral indexing capabilities and
multiple blades. The wafer saw, because of its variable indexing capabilities,
can dice wafers having a plurality of differently sized semiconductor devices thereon
into their respective discrete components. In addition, the wafer saw with its
multiple blades, some of which may be independently laterally or vertically movable
relative to other blades, can more efficiently dice silicon wafers into individual
semiconductor devices.
