Probe cards are configured with protective circuitry suitable for use in electrical
testing of semiconductor dice without damage to the probe cards. Protective fuses
are provided in electrical communication with conductive traces and probe elements
(e.g., probe needles) of a probe card. The fuses may be active or passive fuses
and are preferably self-resetting, repairable, and/or replaceable. Typically, the
fuses will be interposed in, or located adjacent to, conductive traces residing
over a surface of the probe card. Methods of fabricating a probe card are provided,
as well as various probe card configurations. A semiconductor die testing system
using the probe card is also provided.
