An apparatus for mounting semiconductor chips comprises a loading station for
the presentation of substrates, a first transport system and a second transport
system. The first transport system removes one substrate after the other from the
loading station and passes them on to the second transport system which transports
the substrates in steps to a dispensing or soldering station and to a bonding station.
A sensor with two coils arranged at a distance to one another is arranged in such
a way that one end of the substrate transported by the first transport system travels
through a gap formed between the two coils. The signal delivered by the sensor
is used to determine a control signal which indicates whether or not the first
transport system should pass the substrate on to the second transport system.
