A highly efficient method for cleaning a substrate, whereby in the cleaning of
the substrate, {circle around (1)} in a short time, {circle around (2)} both particle
contaminants and metal contaminants can be removed, and {circle around (3)} a problem
associated therewith, such as re-deposition of contaminants or a dimensional change
due to etching, can be remarkably reduced, and which has the following characteristics.
A method for cleaning a surface of a substrate, which comprises at least the
following
steps (1) and (2), wherein the step (2) is carried out after carrying out the step (1):
Step (1): A cleaning step of cleaning the surface of the substrate with an alkaline
cleaning agent containing a completing agent, and
Step (2): A cleaning step employing a cleaning agent having a hydrofluoric acid
content C (wt %) of from 0.03 to 3 wt %, wherein the cleaning time t (seconds)
of the substrate with said cleaning agent is at most 45 seconds, and C and t satisfy
the relationship of 0.25tC1.295.
