A carboxyl group-containing photosensitive resin is obtained by reacting an unsaturated
group-containing monocarboxylic acid (d) with a reaction product (c) of a phenolic
novolak resin (a) and an alkylene oxide (b) and further reacting a polybasic acid
anhydride (f) with the resultant reaction product (e). A photocurable and thermosetting
composition comprising (A) the carboxyl group-containing photosensitive resin mentioned
above, (C) a photopolymerization initiator, and (D) an epoxy resin, or further
comprising (B) a photosensitive (meth)acrylate compound, preferably further comprising
(E) an organic solvent and/or (F) a curing catalyst is useful as an ultraviolet-curable
type printing ink, various resists and interlaminar insulating materials to be
used in the manufacture of printed circuit boards, or the like.
