A CCD and CMOS image pickup module including a circuit main board on which an
image
sensor (CMOS, CCD) and relevant electronic elements are laid. A lens seat is disposed
on an upper edge of a package of the image sensor. The lens seat has an image pickup
cylinder correspondingly positioned above a coupling transistor of the image sensor.
The lens seat covers and encloses the image sensor with the connecting section
of the bottom of the image pickup cylinder sealedly attaching to the periphery
of the top face of the package of the image sensor. With the profile of the outer
periphery of the package of the image sensor serving as a normal standard for the
axis of the lens, the axis of the lens being projected onto the sensor center of
the coupling transistor.
