A method and apparatus of assembling and disassembling semiconductor dice to
be
tested from the components of a temporary test package. A computer-controlled vision
system is employed to align the dice with the temporary test package bases, and
an automated robot arm system is employed to retrieve and assemble the dice with
the various package components. The invention has particular utility in the burn-in
and other pre-packaging testing of dice to establish known good dice (KGD).
