A resin package 1 is hollowed in order to house components of a hybrid
optical
module. Laser devices 7 and 8 are die-bonded to metal frames 2
and 3, respectively. Ends of the metal frames are bent, and then embedded
into the resin package 1 as in-resin bent portions 4, 5, and 6.
In a frame led-out portion 10, portions of the metal frames 2 and
3 are led out to the outside of the resin package 1. The led-out
portion 10 is made in contact with a metal plate, an aluminum die cast member,
or the like which is outside the package, whereby the heat radiation effect is improved.
