A computing device is disclosed. The computing device includes a shock mount
assembly
that is configured to provide impact absorption to sensitive components such as
a display and an optical disk drive. The computing device also includes an enclosureless
optical disk drive that is housed by an enclosure and other structures of the computing
device. The computing device further includes a heat transfer system that removes
heat from a heat producing element of the computing device. The heat transfer system
is configured to thermally couple the heat producing element to a structural member
of the computing device so as to sink heat through the structural member, which
generally has a large surface area for dissipating the heat.
