A multilayer ceramic electronic component is prepared by covering a capacitor
element
with a thermoplastic resin layer that is mounted on a substrate by soldering. The
thermoplastic resin layer is molten due to the heat required for soldering. The
molten resin layer flows to expose external electrodes of the electronic component.
The exposed external electrodes are soldered to electrodes of the substrate. In
the resultant mounting structure, the thermoplastic resin layer covers substantially
the entire surface except for the soldered portion of the electronic component
and a portion of the solder.
