Inspection method, apparatus, and system for a circuit pattern, in which
when various conditions which are necessary in case of inspecting a fine circuit
pattern by using an image formed by irradiating white light, a laser beam, or a
charged particle beam are set, its operating efficiency can be improved. An inspection
target region of an inspection-subject substrate is displayed, and a designated
map picture plane and an image of an optical microscope or an electron beam microscope
of a designated region are displayed in parallel, thereby enabling a defect distribution
and a defect image to be simultaneously seen. Item names of inspecting conditions
and a picture plane to display, input, or instruct the contents of the inspecting
conditions are integrated, those contents are overlapped to the picture plane and
layer-displayed, and all of the item names are displayed in parallel in a tab format
in the upper portion of the picture plane of the contents. When a desired item
name is clicked, the picture plane is switched and the contents corresponding to
the clicked item name are displayed.
