Peeling between a molding resin and a substrate is prevented to improve the
quality of a semiconductor device. A film substrate capable of being deformed following
shrinkage upon curing of a molding resin and having plural partitioned device areas
is provided, then a block molding is performed so as to cover the plural device
areas in a lump on a chip bearing surface side of the film substrate, and thereafter
the film substrate is subjected to dicing wherein a cutting blade is advanced toward
a block molding portion to divide the film substrate device area by device area
in accordance with a down cutting method, whereby peeling of the substrate in the
dicing work can be prevented.
