The present invention deposits a conductive material from an electrolyte solution
to a predetermined area of a wafer. The steps that are used when making this application
include applying the conductive material to the predetermined area of the wafer
using an electrolyte solution disposed on a surface of the wafer, when the wafer
is disposed between a cathode and an anode, and preventing accumulation of the
conductive material to areas other than the predetermine area by mechanically polishing
the other areas while the conductive material is being applied.
