The present invention provides an improved method and apparatus for manufacturing
communication devices. A cover is attached to a surface of a faceplate that includes
at least one opening, to provide enhanced device protection and sound quality.
In one embodiment of the present invention, ultrasonic energy is used to cleanly
and efficiently attach a cover to an inner surface of the faceplate. Advantageously,
the present invention provides for improved manufacturing consistency and efficiency
while also improving product quality.
