A sensor package P is a surface-mounted sensor package which is adapted to be
mounted
on a printed board 200. The sensor package P includes a case 1 for
accommodating a semiconductor acceleration sensor chip 100 having output
pads 101. The case has a bottom wall 10, which is divided into a
center area 10a for supporting the sensor chip 100 and a peripheral
area 10b. Output electrodes 15 to be connected to the output
pads 101 are formed on external surfaces of the peripheral area. These output
electrodes 15 are soldered to the printed board 200 for electrical
connection between the sensor chip and an electric circuit of the printed board
as well as for holding the sensor package physically on the printed board. The
feature of the present invention resides in that grooves 12 are formed in
an interior surface of the bottom wall 10 between the center area 10a
and the peripheral area 10b.
