A multichip semiconductor package and method of making is provided that has a
plurality
of semiconductor chips fabricated in electrical isolation one from another integrally
on a singular coextensive substrate useful for numerous and varied semiconductor
chip applications. The semiconductor chips, instead of being singulated into a
plurality of single-chip packages, are kept as integrally formed together and are
thereafter electrically connected together so as to form a larger circuit. Encapsulation
follows so as to form a single, multichip package. Common signals of the plurality
of semiconductor chips are bussed together in electrical common across the substrate
to a common electrode suitable for electrically providing the signal to another,
external circuit, such as a PWB. The common bussing is achieved by conductive leads
disposed across the substrate in pair sets having an extended portion that accommodates
the common electrode in contact therewith. The common electrode contacts the conductive
lead through an opening formed in the encapsulant that surrounds the substrate.
The extended portions of each conductive lead are staggered with respect to the
extended portion of the conductive lead in the same, or juxtaposed, pair set. In
this manner, multiple electrodes are available for close proximity positioning
while, simultaneously, avoiding electrical shorts amongst the pair sets.
